Profile

ali fallah-adl

staff packaging engineer

11

Years of Experience

Education

arizona state university, arizona state university, university of tabriz

Companies

qualcomm, intel, intel, intel, arizona state university

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ali's contact details

Email

Email (Verified)

aliXXXXXXXXXXXXXXXXXom

Email

Mobile Number

+14XXXXXXX03

Experience

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    2016 - 2022

    qualcomm

    staff packaging engineer

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    2014 - 2016

    intel

    senior research and development engineer - chip attach module

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    2013 - 2014

    intel

    senior research and development engineer - die prep module

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    2012 - 2013

    intel

    graduate technical intern - integrated heat sink module

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    2006 - 2008

    arizona state university

    graduate research associate

Experience

76 Skills

abaqus

advanced electronic materials

advanced materials

alloys

c

characterization

chip attach

chip package interaction

cost management

design for manufacturing

design of experiments

design rule

die attach

die prep

die singulation

dimensional metrology

effective problem solving and root cause anal

failure analysis

failure mode and effects analysis

finite element analysis

heat transfer

ic package design integration

integrated circuits

integration

interpersonal skills

iso 9001

jmp

lean manufacturing

material characterisation

materials science

materials science and engineering

matlab

mechanical drawings

mechanical engineering

metrology

microsoft office

nanotechnology

operational risk management

optical microscopy

package mass reflow

package reliability

packaging process development

physics

probabilistic models

process auditing

program management

quality assurance

reliability test

Research

research and development

Research and Development (R&D)

Research Scientist

risk management

scanning electron microscopy

semiconductor package engineering

semiconductors

silicon

simulations

smt

solder paste print

solidworks

spc

sql

statistical data analysis

statistical process control

supplier management

supplier quality management

supplier risk management

surface metrology

surface mount technology

tableau

thermal compression bonding

thin films

tsv

wafer bonding

wlp/fo/fx

Education

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    2008 - 2013

    arizona state university

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    2006 - 2008

    arizona state university

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    1995 - 1999

    university of tabriz